Thermally conductive and vibration damping electronic device enclosure and mounting

ABSTRACT

A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 16/132,517, filed on Sep. 17, 2018 and entitled “THERMALLYCONDUCTIVE AND VIBRATION DAMPING ELECTRONIC DEVICE ENCLOSURE ANDMOUNTING”, now issued as U.S. Pat. No. 10,558,247, issued on Feb. 11,2020, which is a continuation-in-part of U.S. patent application Ser.No. 15/795,776, filed on Oct. 27, 2017 and entitled “THERMALLYCONDUCTIVE AND VIBRATION DAMPING ELECTRONIC DEVICE ENCLOSURE ANDMOUNTING”, now issued as U.S. Pat. No. 10,079,042, issued on Sep. 18,2018, which is a continuation-in-part of U.S. patent application Ser.No. 14/986,683, filed on Jan. 2, 2016 and entitled “THERMALLY CONDUCTIVEAND VIBRATION DAMPING ELECTRONIC DEVICE ENCLOSURE AND MOUNTING”, nowissued as U.S. Pat. No. 9,804,644, issued on Oct. 31, 2017, which claimsthe priority of U.S. Provisional 62/099,194, filed on Jan. 1, 2015 andentitled “APPARATUS AND METHOD FOR USING THERMALLY CONDUCTIVE PLASTICFOR ELECTRONIC DEVICE ENCLOSURE AND MOUNTING” all of which is herebyincorporated by reference in its entirety.

TECHNICAL FIELD

This disclosure relates to a system and method for heat dissipation andvibration damping of electronic devices by installing the electronicdevices in a thermally conductive plastic assembly that provides forthermal conduction and vibration damping of an electronic device.

BACKGROUND

The heat generated by the internal components of electronic devices haslong been a significant factor determining the design of microelectronicsystems. Semiconductors typically have a threshold temperature abovewhich their performance is severely degraded, thus the internal coolingof electronic equipment has been a parameter of great interest todesigners and manufacturers. Some common forms of heat dissipation inearly electronics designs were liquid to gas phase change of a fluid indirect contact with the heat-generating device (Camp, in U.S. Pat. No.2,883,591; April 1959), metal-to-metal contact heat conduction away fromthe heat-generating components (Deakin, in U.S. Pat. No. 2,917,286;December 1959), a heat sink in direct thermal contact with themechanical structure of the device (Potter, et al. in U.S. Pat. No.3,196,317; July 1965), and solid to liquid phase change of a substancein thermal contact with the heat-generating device (Haumesser, et al. inU.S. Pat. No. 3,328,642; June 1967).

The most common forms of heat dissipation in early personal computerdesigns involved direct physical contact between heat-generatingintegrated circuits and a heat-conducting heat sink mass such asaluminum, and non-turbulent airflow, typically generated by electricalfans, to circulate cool air through a space interior to the computersystem housing. In the early large-scale computing systems of the 1940sand 1950s, heat dissipation consisted primarily of ventilation aperturesin housings, followed by ambient-air fans and blowers which cooled byforced air convection.

Zelina, in U.S. Pat. No. 3,566,958 (1971), describes a means ofthermally coupling heat conductors to integrated circuit chips, thoughwithout addressing how to transport the heat contained in theheat-conducting material away from the space surrounding the electricaldevice. In U.S. Pat. No. 3,648,113 (1972) Rathjen describes a means ofstacking planar electronic devices, with spacing between the flatplanes, and cooling the entire assembly using fluid flow across the flatsurfaces; the cooling fluid exits the entire assembly, therebytransporting heat away from the heat-generating electronics. Schulerdiscloses an electronics system casing with good thermal conductionproperties in U.S. Pat. No. 3,699,394 (1972); the case was presumed tobe of metallic composition, though possibly sealed or bonded withthermally conductive epoxy. Austin, in U.S. Pat. No. 3,737,728 (1973)discloses a mounting structure for fragile heat-generating devices (e.g.devices used in computer apparatuses), as well as uniformity of heatconduction and good heat dissipation away from the core assembly area.These ideas are combined in U.S. Pat. No. 3,865,183 (1975), in whichRoush describes a more comprehensive means of constructing a fullcomputer assembly with good heat dissipation characteristics of theindividual circuit boards in the module, with fluid flow for removal ofheat energy from the assembly.

As demand for ruggedized portable electronic devices increased,engineers began to incorporate shock and vibration damping features intoelectronic system designs. Damping of vibration and shock forces isparticularly important for hard disk drives (magnetic spinning platterdisk drives) which are susceptible to externally generated vibrationsand shocks that may cause a read head to make physical contact with aspinning surface, thereby rendering unreadable the information containedin that physical portion of the platter surface. Damping of internallygenerated kinetic forces that result in vibration is important forreliable operation of hard disk drives and collections of hard diskdrives that are mounted in the same enclosure.

U.S. Pat. No. 4,382,587 (Heinrich, et al, May 1983) disclose a means forvibration damping for an electronic component and system designs. U.S.Pat. No. 6,618,246 (Sullivan et al., September 2003) disclose a designthat incorporates thermal conduction and shock resistance in distinctivefeatures for an electronic unit. U.S. Pat. No. 8,050,028 (Merz et al.,November 2011) disclose a design that incorporates thermal conductionand shock resistance in distinctive features for a computing device.U.S. Pat. No. 8,199,506 (Janik et al., June 2012) disclose a design forthermal conduction and shock resistance for a solid state data storageassembly. U.S. Pat. No. 8,913,390 (Malek et al., December 2014) disclosea design for thermal conduction and shock resistance at the edge surfaceof a printed circuit board. U.S. Pat. No. 6,151,216 (Vos et al.,November 2000) disclose a design that incorporates thermal conductionand shock and vibration resistance in the same feature by using a wirerope connected to both a housing and an enclosed electronic device. U.S.Pat. No. 8,520,390 (Okamoto et al., August 2013) disclose a design thatincorporates thermal conduction and vibration damping for anelectro-mechanical device using two separate materials with distinctivecharacteristics.

Despite heat dissipation innovations for electronic devices in general,the hard disk drive (magnetic spinning platter disk drive) is a computercomponent that continues to accomplish low-efficiency heat dissipationprimarily by means of air circulation around the exterior of the diskdrive unit. Such a hard disk drive unit is a data storage device usedfor storing and retrieving digital information using rapidly rotatingdisks (platters) coated with magnetic material. Digital information iswritten to and read from the rotating disks by means of a sensor on amechanical arm that is literally flown over the surface of the disk. Theatmospheric environment inside the disk drive unit is critical to the“fly-height” of the sensor. Therefore, almost all hard disk drive unitsare designed to allow atmospheric air to enter and leave the unit asnecessary to maintain a suitable molecular composition and pressure ofgas inside the disk drive unit. Because the hard disk drive units a)must remain open to the atmosphere and b) produce rotational andtranslational vibration that must be damped for proper operation, diskdrive units commonly use air circulation around the exterior of the diskdrive unit for heat dissipation. Two major exceptions to the common harddisk drive design exist in the market today—the SSD and the heliumfilled hard disk drive. The SSD is a “solid-state disk” that iscomprised of solid state memory chips and has no moving parts. Thehelium filled hard disk drive unit is a hermetically sealed unitdesigned to internally contain a helium environment instead ofatmospheric air. Examples of a helium filled hard disk drive unit areproduced by HGST and Seagate. All disk drive units can benefit greatlyfrom an improved means of heat dissipation that results in improvedperformance, reliability, and disk drive unit longevity. Optical platterdisk drives are subject to many of the same limitations as magneticspinning platter disk drives.

Current solutions for electronic device mounting and enclosures thatcombine vibration damping with heat dissipation have significantshortcomings. Typically, current solutions for electronic devicemounting and enclosures are optimized for only one of a) manufacturingcost, b) thermal transfer, or c) vibration damping. The solutions thatare low in manufacturing costs are typically air-cooled and result inmarginal cooling and vibration damping performance. The solutions thatare optimized for thermal transfer are typically constructed as customcold-plate designs with tight tolerances and complex cooling piping thatresult in higher manufacturing costs, higher system maintenance costs,and lower vibration damping. The solutions that are optimized forvibration damping are typically air-cooled and require moderatelycomplex structural elements resulting in marginal cooling performance,larger overall unit sizes, and higher manufacturing costs. The solutionsthat are optimized for vibration damping and heat dissipation aretypically constructed with complex structural elements resulting inlarger overall unit sizes, and higher manufacturing costs, and highersystem maintenance costs. For example, the heat-conducting wire ropesolution of U.S. Pat. No. 6,151,216 requires attachment points for thewire rope on both the exterior casing or chassis and the electronicdevice itself. A failure of either attachment point, or a fatiguefailure of the wire rope itself after prolonged exposure to small-scalevibrations, causes loss of both heat conduction and vibration dampingfunctionality.

Thermally conductive plastics and elastomers are newer marketplaceinnovations that enable excellent thermal conduction, mechanicalstrength, and vibration damping properties in a single material and areuseful for such applications as heat exchangers, heat sinks, enclosures,and electronics substrates and packaging. Two examples of potentialcommercial applications of thermally conductive plastics are disclosedin U. S. Patent Application US20100012354 A1 (2009), in which Hedin andMiller describe a printed circuit board contains a thermally conductivedielectric layer; and Patent Application WO2013171483 A1 (2012), inwhich Lee and Laverick disclose a vessel of thermally conductive plasticfor freeze-drying.

The inventions disclosed herein overcome many of the shortcomings ofprior art in relation to the heat dissipation and vibration damping ofelectronic devices. Thermally conductive polymers enable significantdesign improvements as disclosed herein. In particular, mountingassemblies can be constructed using thermally conductive polymers withlow cost manufacturing techniques that create assemblies that are incontact with and interposed between the electronic device to be cooledand the supporting structure for the electronic device. This contacttype of assembly transmits heat as much as one hundred times moreefficiently than air while at the same time effectively absorbingvibrations and shock that would normally act on the electronic device orbe passed on to the supporting structure. This is a significantimprovement on current processes, eliminating or greatly reducing therequirement for inefficient air exchange cooling and thereby enablingthe installation of electronic devices in a sealed enclosure. Theseimprovements result in lower manufacturing costs as well as electronicdevice performance improvements that include longer life, higherreliability, and lower maintenance. Further, this is an enablingimprovement for the systems in which the devices are installed resultingin higher system density designs, smaller system size, lowermanufacturing costs, higher environmental tolerances, lower maintenancecosts, more flexibility in installation locations, better control ofsystem heat dissipation, lower operational noise, and much higherphysical, electrical, and magnetic system security.

BRIEF DESCRIPTION OF THE INVENTION

Various embodiments of a system and method for heat dissipation andvibration damping assembly for electronic devices are disclosed herein.

At least one embodiment described herein provides a heat dissipation anda vibration damping assembly for electronic devices, such assemblyformed by one or more surfaces that are comprised of thermallyconductive plastic (“Plastic Device Mounting Assembly”) that combine topartially or completely enclose one or more electronic devices as aphysical and thermal intermediary between an electronic device andsupporting structure(s) for the electronic device. Such embodiments areoptimized for direct and indirect transfer of thermal energy away fromheat-generating electronics into the surrounding supporting structures,enclosures, and ultimately into an adjacent or remote environment.Further, such embodiments include the mitigation of vibrations and/orshock that act on the electronic device or are created by the electronicdevice.

Embodiments of the Plastic Device Mounting Assembly have varieddimensional and physical characteristics that may lead to variousdescriptions of the Plastic Device Mounting Assembly that include, butare not limited to, vessel, canister, container, fixture, enclosure,wrapper, holder, caddy, case, drawer, rail, cap, glove, grommet, orjacket. The Plastic Device Mounting Assembly may be comprised of one ormore components that combine to form a whole unit, an example of whichis a clamshell type embodiment in which the Plastic Device MountingAssembly has a top section and a bottom section that fit in closeproximity to form a single Plastic Device Mounting Assembly.

Multiple configuration options are described to optimize the use ofPlastic Device Mounting Assemblies. The installation can be in anyorientation and can be used as a standalone assembly or as a componentof other assemblies. Plastic Device Mounting Assemblies may beconfigured as single units or may be stacked or grouped together to forma structural unit of any dimensionality in a high-density configuration.The disclosed design leads to cooler operation, reduced vibration,longer life, higher reliability, and lower maintenance of electronicdevices.

These and other aspects of the disclosed subject matter, as well asadditional novel features, will be apparent from the descriptionprovided herein. The intent of this summary is not to be a comprehensivedescription of the claimed subject matter, but rather to provide a shortoverview of some of the subject matter's functionality. Other systems,methods, features and advantages here provided will become apparent toone with skill in the art upon examination of the following FIGS anddetailed description. It is intended that all such additional systems,methods, features and advantages that are included within thisdescription, be within the scope of the claims.

BRIEF DESCRIPTION OF FIGURES

The features characteristic of the invention are set forth in theclaims. However, the invention itself and further objectives andadvantages thereof, will best be understood by reference to thefollowing detailed description when read in conjunction with theaccompanying drawings in which the left-most significant digit(s) in thereference numerals denote(s) the first figure in which the respectivereference numerals appear, wherein:

FIG. 1 shows a conceptual view of a heat dissipation and a vibrationdamping assembly associated with at least one electronic device that isformed by one or more surfaces that are comprised of thermallyconductive plastic according to an embodiment of the disclosed subjectmatter.

FIG. 2 shows an additional embodiment of a heat dissipation and avibration damping assembly of FIG. 1.

FIG. 3 shows an additional embodiment of a heat dissipation and avibration damping assembly of FIG. 1.

FIG. 4 shows a conceptual view of a collection of Plastic DeviceMounting Assemblies and electronic devices associated with a supportingstructure according to an embodiment of the disclosed subject matter.

FIG. 5 shows a conceptual view of a collection of Plastic DeviceMounting Assemblies and electronic devices associated with a supportingstructure according to an embodiment of the disclosed subject matter.

FIG. 6 is a flow diagram of an example technique for forming a heatdissipation and a vibration damping assembly that includes a thermallyconductive and vibration damping plastic structure between an electronicdevice and a supporting structure.

FIG. 7 shows an additional embodiment of a Plastic Device MountingAssembly according to an embodiment of the disclosed subject matter.

FIG. 8A shows a view of an additional embodiment of a collection ofPlastic Device Mounting Assemblies attached to a supporting structureaccording to an embodiment of the disclosed subject matter.

FIG. 8B shows a view of an additional embodiment of a collection ofPlastic Device Mounting Assemblies attached to a supporting structureaccording to an embodiment of the disclosed subject matter.

FIG. 9A shows an additional embodiment of Plastic Device MountingAssemblies attached to at least one electronic device according to anembodiment of the disclosed subject matter.

FIG. 9B shows an additional embodiment of Plastic Device MountingAssemblies attached to at least one electronic device according to anembodiment of the disclosed subject matter.

FIG. 10 shows an additional embodiment of a collection of Plastic DeviceMounting Assemblies and electronic devices associated with a supportingstructure according to an embodiment of the disclosed subject matter.

FIG. 11A shows a conceptual view of supporting structure configurationsaccording to an embodiment of the disclosed subject matter.

FIG. 11B shows a conceptual view of supporting structure configurationsaccording to an embodiment of the disclosed subject matter.

FIG. 11C shows a conceptual view of supporting structure configurationsaccording to an embodiment of the disclosed subject matter.

FIG. 12 shows an additional embodiment of a heat dissipation and avibration damping assembly associated with at least one electronicdevice according to an embodiment of the disclosed subject matter.

DETAILED DESCRIPTION

Although described with reference to certain embodiments, those withskill in the art will recognize that the disclosed embodiments haverelevance to a wide variety of areas in addition to those specificexamples described below. Further, elements from one or more embodimentsmay be used in other embodiments and elements may be removed from anembodiment and remain within the scope of this disclosure.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein; provided, however, to the extent there exists a conflict betweenthis disclosure and a document incorporated by reference, thisdisclosure shall control.

As referenced herein, the terms “thermally conductive plastic”,“thermally conductive and vibration damping plastic”, “thermallyconductive elastomer”, “thermally conductive viscoelastic”, and“thermally conductive polymer” are used interchangeably.

As referenced herein, vibration is defined as movement of an electronicdevice in any X, Y, Z plane that is a result of a rotational,translational, oscillating, vibratory, shock, or other kinetic forces.

As referenced herein, vibrational forces are forces to which anelectronic device is subject as a result of vibration.

As referenced herein, vibration damping is the attempt to minimize oreliminate vibrational forces that act on an electronic device and/or thetransmission of said vibrational forces to or from associated oradjacent objects such as structures, enclosures, or other devices.

As referenced herein, interpose is defined as disposing an object to beor come between at least two other objects.

FIG. 1 shows a conceptual view of a heat dissipation and a vibrationdamping assembly 150 associated with at least one electronic device 104,said assembly 150 formed by one or more surfaces that are comprised ofthermally conductive plastic (“Plastic Device Mounting Assembly”) thatcombine to partially or completely enclose or surround said at least oneelectronic device 104 as a physical and thermal intermediary betweensaid at least one electronic device 104 and supporting structuresassociated with said at least electronic device 104. The Plastic DeviceMounting Assembly 101, also known as a “thermally conductive andvibration damping plastic structure”, is comprised of thermallyconducting plastic configured as one or more associated components.

The electronic device 104 is any type of heat-generating electronicdevice, including but not limited to, a circuit board, motherboard,computing unit, hard disk drive (magnetic spinning platter disk drive),optical disk drive (optical spinning platter disk drive), solid statedrive, electronic memory, electronic component, or electronic assembly.Further, such an electronic device 104 may have operational kineticprocesses that result in vibration. The Plastic Device Mounting Assembly101 is optimized for direct and indirect transfer of thermal energy awayfrom electronic devices 104 into the surrounding supporting structure,enclosures, and ultimately into an adjacent or remote environment.Further, such embodiments include vibration damping of electronicdevices 104 in order mitigate the amount of vibrations and shock thatwould normally act on the electronic device 104 or be passed to or fromthe supporting structure of the electronic device 104.

Embodiments of the Plastic Device Mounting Assembly 101 have varieddimensional and physical characteristics that may lead to variousdescriptions of the Plastic Device Mounting Assembly 101 that include,but are not limited to, vessel, canister, container, fixture, enclosure,wrapper, holder, caddy, case, drawer, rail, cap, glove, grommet, orjacket. The Plastic Device Mounting Assembly 101 may be comprised of oneor more components that combine to form a whole unit, an example ofwhich is disclosed herein in which the Plastic Device Mounting Assembly101 has a top section 111 and a bottom section 112 that fit in closeproximity or adjacent to the electronic device 104 to form a singlePlastic Device Mounting Assembly 101. Additional embodiments of aPlastic Device Mounting Assembly 101 are disclosed in FIGS. 2, 3, 7, 8,9, 12.

Embodiments of the Plastic Device Mounting Assembly 101 are comprised ofvaried material construction in which the Plastic Device MountingAssembly 101 a) is comprised of a homogeneous thermally conductive andvibration damping material interposed between the electronic device 104and supporting structures associated with the electronic device 104, orb) is comprised of a plurality of materials wherein at least one of theplurality of materials is i) both thermally conductive and vibrationdamping and ii) interposed between the electronic device 104 andsupporting structures associated with the electronic device 104.

A Plastic Device Mounting Assembly 101 is interposed between anelectronic device 104 and the supporting structure for said electronicdevice 104 and functions as a thermal and physical intermediary betweensaid electronic device 104 and said supporting structure for saidelectronic device 104. The amount of surface area of Plastic DeviceMounting Assembly 101 that is in contact with an electronic device 104may vary and is dependent on the thermal and vibrational operationalcharacteristic of the electronic device 104. The amount of surface areaof Plastic Device Mounting Assembly 101 that is in contact with thesupporting structure associated with an electronic device 104 may varyand is dependent on the thermal and vibrational operationalcharacteristic of said supporting structure and said associatedelectronic device 104.

A supporting structure is any structural component that is locatedoutside the region occupied by a Plastic Device Mounting Assembly 101and the electronic device 104 associated with said Plastic DeviceMounting Assembly 101 and serves one or more functions such as a) theconstraint of a Plastic Device Mounting Assembly 101, b) transport ofheat that originates in an electronic device 104 and flows through anassociated Plastic Device Mounting Assembly 101 into said supportingstructure, c) allows serviceable replacement of said Plastic DeviceMounting Assembly 101 and/or the associated electronic device 104, andd) creates a unit comprised of a plurality of Plastic Device MountingAssembly 101 and associated electronic devices 104. A supportingstructure may be constructed of any thermally conductive material orcomponent with suitable properties. A supporting structure may becomprised of one or more components such that a reference herein to“supporting structures” has the same meaning as “supporting structure”.One embodiment of a supporting structure creates a compression interfacebetween the supporting structure, Plastic Device Mounting Assembly 101,and associated electronic device 104. In another embodiment, thesupporting structure, Plastic Device Mounting Assembly 101, andassociated electronic device 104 are attached together by mechanical orchemical means that comprise screws, bolts, pins, clamps, slides,sockets, brackets, rivets, adhesives, locking/clipping structures,connection fingers, adhesives, thermal pastes, thermal pads, and thermalepoxies. However, the specific design and configuration of a supportingstructure is dependent on a) each specific electronic device 104 andassociated Plastic Device Mounting Assembly 101, and b) the overallsystem into which said electronic device 104 and associated PlasticDevice Mounting Assembly 101 is disposed. Embodiments of supportingstructures are disclosed in FIGS. 4, 5, 8, 10, 11, 12.

A Plastic Device Mounting Assembly 101 may have design features thatenhance the ability of a Plastic Device Mounting Assembly 101 tophysically maintain contact with an associated electronic device 104such as holes, slots, tabs, rails, inserts, studs, dowels, keyholes, andkeyways. A Plastic Device Mounting Assembly 101 may have design featuresthat enhance the ability of a Plastic Device Mounting Assembly 101 tophysically maintain contact with an associated supporting structure suchas holes, slots, tabs, rails, inserts, studs, dowels, keyholes, andkeyways. A Plastic Device Mounting Assembly 101 may be a) physicallyconnected to an associated electronic device 104 by mechanical orchemical means that comprise screws, bolts, pins, clamps, slides,sockets, brackets, rivets, adhesives, locking/clipping structures,connection fingers, adhesives, thermal pastes, thermal pads, and thermalepoxies, b) physically connected to an associated supporting structureby mechanical or chemical means that comprise screws, bolts, pins,clamps, slides, sockets, brackets, rivets, adhesives, locking/clippingstructures, connection fingers, adhesives, thermal pastes, thermal pads,and thermal epoxies, or c) physically connected to both an associatedelectronic device 104 and an associated supporting structure bymechanical or chemical means that comprise screws, bolts, pins, clamps,slides, sockets, brackets, rivets, adhesives, locking/clippingstructures, connection fingers, adhesives, thermal pastes, thermal pads,and thermal epoxies. The electronic device 104 is not directlyphysically connected to an associated supporting structure except whenas determined by design, an embodiment may exist in which saidelectronic device 104 may be directly connected to said associatedsupporting structure such that vibrational forces are sufficientlydamped by the Plastic Device Mounting Assembly 101 that is disposedbetween said electronic device 104 and said associated supportingstructure.

A Plastic Device Mounting Assembly 101 has a dimensionality that forms areflected image of at least a portion of the surface of an electronicdevice 104 such that said reflected image comprises at least one of thefollowing configurations in which a) portions of said reflected imageare in direct thermal contact with said surface of said electronicdevice 104, b) portions of said reflected image are in indirect thermalcontact with said surface of said electronic device 104 having thermalinterface materials disposed between said portions of said reflectedimage and said surface of said electronic device 104, c) portions ofsaid reflected image are in direct mechanical contact with said surfaceof said electronic device 104, d) portions of said reflected image havea designated gap that exists between said reflected image and saidsurface of said electronic device 104, and e) portions of said reflectedimage protrude above the predominate surface of said reflected image informs that comprise constructions that include, but are not limited to,ribs, truncated spheres, or fins, said constructions in directmechanical contact with said surface of said electronic device 104.

A Plastic Device Mounting Assembly 101 is configured with adimensionality that provides advantageous thermal functionality for theassociated electronic device 104. Examples of said advantageous thermalfunctionality of a Plastic Device Mounting Assembly 101 comprise a)dielectric thermally conductive plastic surfaces that are configured tobe in thermal contact with high heat output electronic components suchas chip packages, processors, FGPA, MOSFET, power components, solidstate memory, and solid state drives, b) thermally conductive plasticsurfaces that are configured to be in thermal contact with a thermallyconductive structural portion of the electronic device 104 such as thealuminum casing of a hard disk drive, c) thermally conductive plasticsurfaces that are configured to be in thermal contact with a thermallyconductive heat pipe, heat sink, or heat spreader that is affixed to theelectronic device 104 or a component of the electronic device 104, d)dielectric thermally conductive plastic surfaces that are configured tobe in thermal contact with larger areas of component filled surfaces ofan electronic device 104, and e) dielectric thermally conductive plasticsurfaces that are configured to be in thermal contact with areas of anelectronic device 104 that are uneven or difficult to contact such asthe back or solder side of an electronic component circuit board.

A Plastic Device Mounting Assembly 101 may be configured with adimensionality that provides advantageous vibrational dampingfunctionality for the associated electronic device 104 by configurationsthat comprise a) thermally conductive plastic surfaces with vibrationdamping qualities suitable for a particular electronic device 104, b)contact with the electronic device 104 at corners, surfaces, sides, orcomponents where vibrational forces to be damped are present, c) aparticular dimensionality that damps the undesirable vibrational forcesat a particular location without amplifying other vibrational forces atsaid location, d) a damping capability that is designed to mitigate theoperational vibrational forces of the electronic device 104 that aretransmitted to any associated supporting structure, and e) a dampingcapability that is designed to mitigate vibration, impulse, and/or shockforces that are transmitted to the electronic device 104 from anassociated supporting structure.

A Plastic Device Mounting Assembly 101 has a dimensionality that forms areflected image of at least a portion of the surface of the supportingstructure such that said reflected image comprise at least one thefollowing configurations in which a) portions of said reflected imageare in direct thermal contact with said surface of said supportingstructure, b) portions of said reflected image are in indirect thermalcontact with said surface of said supporting structure having thermalinterface materials disposed between said portions of said reflectedimage and said surface of said supporting structure, c) portions of saidreflected image are in direct mechanical contact with said surface ofsaid supporting structure, and d) portions of said reflected image havea designated gap that exists between said reflected image and saidsurface of said supporting structure, and e) portions of said reflectedimage protrude above the predominate surface of said reflected image informs that comprise constructions that include, but are not limited to,ribs, truncated spheres, or fins, said constructions in directmechanical contact with said surface of said supporting structure.

The Plastic Device Mounting Assembly 101 is comprised of a materialknown herein as “thermally conducting plastic” that comprises propertiesas follows: a) a polymer with any combination of thermoplastic,elastomeric, and viscoelastomeric properties, b) electrically conductingor electrically insulating, c) enhanced thermal conduction typicallyaccomplished by adding particles of thermally conducting materials thatare distributed throughout the polymer matrix, d) a minimum thermalconductivity of about 1.0 watts per meter-Kelvin (W/mK), e) resilienceto deform elastically to provide a measure of vibration damping betweenan electronic device 104 and an associated supporting structure, and f)a Shore A hardness of less than about 70.

The polymer matrix of the thermally conducting plastic may comprise awide range of polymeric materials comprising polypropylene, polyethylene(including high and low-density polyethylene as well as derivatives suchas polyethylene terephthalate and polytetrafluoroethylene) polyester,polyacrylate, polystyrene, polyamide, polycarbonate, polyphthalamide,polyphenylene sulfide and polyvinyl polymers such as polyvinylchlorideand nylon, as well as co-polymers containing these such asacrylonitrile-butadiene-styrene. The particles of thermally conductingmaterial that may be present within the polymeric matrix may be selectedfrom a wide range of materials comprising metals such as aluminum,nickel, gold or silver or alloys containing these or other alloys suchas brass or stainless steel, metal or metalloid salts such as boronnitride, boron carbide, alumina, aluminum nitride, aluminum oxide,magnesium oxide, titanium oxide, iron oxide, tin oxide, beryllium oxide,zinc oxide, and calcium carbonate, carbon based materials such asgraphite, carbon in the form of graphene, carbon nanotubes, orfullerenes, carbon in the form of carbon fiber, powder or flake,acetylene black or carbon black, as well as other materials such asglass or ceramics or mixtures or combinations of these. The particlesmay take the form of fibers, flakes, powders, whiskers or microspheres.

Thermally conducting plastics are characterized by various propertiessuch as thermal conductivity, thermal diffusivity, elasticity,resilience, hardness, and chemical compatibility that are consideredwhen selecting the optimal material composition for an embodiment.Thermally conducting plastics in various compositions and configurationsare commercially available from companies such as Celanese, PolyOne,Berquist, Henkel, RTP, and Dow Corning.

Heat that is generated by an electronic device 104 is transported into aPlastic Device Mounting Assembly 101 which in turn is thermallyconnected to and transports heat to a region exterior to the PlasticDevice Mounting Assembly 101 such as supporting structures, coolingplates, air cooling apparatus, fluid cooling apparatus, immersion singleor multi-phase fluid cooling apparatus, and/or enclosing cases whichserve to reject the heat into an adjacent or remote environment via heatexchange systems. The thermal connection between an electronic device104, the Plastic Device Mounting Assembly 101, the supporting structureand any other thermally connected components in the system may becomprised of direct physical contact or an indirect physical connectionin which thermally conductive pastes, pads, epoxies, fluids, or othermaterials are positioned between or adjacent to contacting surfaces ofthe electronic device 104, the Plastic Device Mounting Assembly 101, thesupporting structure and any other thermally connected components inorder to facilitate optimal thermal transfer.

A Plastic Device Mounting Assembly 101 can be installed in anyorientation and can be used as a standalone assembly or as a componentof other assemblies. Plastic Device Mounting Assemblies 101 may beconfigured as single units or may be stacked or grouped together to forma structural unit of any dimensionality in a high-density configuration.

FIG. 2 shows a conceptual view of a heat dissipation and a vibrationdamping assembly 150 that is an additional embodiment of the disclosuresdescribed in FIG. 1. As illustrated in this embodiment, the PlasticDevice Mounting Assembly 101 may be comprised of a component that has asingle section 212 that fits in close proximity or adjacent to theelectronic device 104. The Plastic Device Mounting Assembly 101 with asingle section 212 and the electronic device 104 have thecharacteristics and functionality as disclosed in FIG. 1.

FIG. 3 shows a conceptual view of a heat dissipation and a vibrationdamping assembly 150 that is an additional embodiment of the disclosuresdescribed in FIG. 1. As illustrated in this embodiment, the PlasticDevice Mounting Assembly 101 may be comprised of a component that has asingle section 312 that fits in close proximity or adjacent to theelectronic device 104. The Plastic Device Mounting Assembly 101 with asingle section 312 and the electronic device 104 have thecharacteristics and functionality as disclosed in FIG. 1.

FIG. 4 shows a conceptual view of an assembly 450 of Plastic DeviceMounting Assemblies 101 and electronic devices 104 associated withsupporting structure 420. Plastic Device Mounting Assemblies 101 andassociated electronic devices 104 are associated with a supportingstructure as illustrated by supporting structure 420 with thecharacteristics and functions referenced by the disclosures in FIG. 1.Any number of Plastic Device Mounting Assemblies 101 and associatedelectronic devices 104 may be grouped together and associated withsupporting structure 420 to form an assembly 450 of any dimensionality.Multiple instances of assembly 450 comprising supporting structures 420,Plastic Device Mounting Assemblies 101 and the associated electronicdevices 104 may be collected together and associated with othersupporting structures as part of a larger functioning unit.

FIG. 5 shows a conceptual view of an assembly 550 of Plastic DeviceMounting Assemblies 101 associated with electronic devices 104 andsupporting structures 520. Plastic Device Mounting Assemblies 101 andassociated electronic devices 104 are associated with supportingstructures as illustrated by supporting structures 520 with thecharacteristics and functions referenced by the disclosures in FIG. 1.Any number of Plastic Device Mounting Assemblies 101 and associatedelectronic devices 104 may be grouped together and associated withsupporting structure 520 to form an assembly 550 of any dimensionality.Multiple instances of assembly 550 comprising supporting structures 520,Plastic Device Mounting Assemblies 101 and the associated electronicdevices 104 may be collected together and associated with othersupporting structures as part of a larger functioning unit. Thesupporting structure 520 may optionally contain fluid channels 521 thatserve as a heat exchange mechanism to facilitate the removal of heatfrom supporting structure 520 that is absorbed by supporting structure520 from Plastic Device Mounting Assemblies 101 and the associatedelectronic device 104.

FIG. 6 is a flow diagram of an example technique for forming a heatdissipation and a vibration damping assembly 150 that comprises athermally conductive and vibration damping plastic structure interposedbetween an electronic device and a supporting structure.

In stage 601, at least one electronic device 104 is provided.

In stage 602, a supporting structure is provided that is associated withat least one electronic device 104, 601 and further arranged totransport and sink heat that originates from the at least one electronicdevice 104, 601.

In stage 603, a Plastic Device Mounting Assembly 101, also known as a“thermally conductive and vibration damping plastic structure” 603, isprovided and comprised of thermally conducting plastic configured as oneor more components. The Plastic Device Mounting Assembly 101 isinterposed between the at least one electronic device 104, 601 and thesupporting structure 602 and functions as a thermal and physicalintermediary between the at least one electronic device 104, 601 and thesupporting structure 602. The Plastic Device Mounting Assembly 101 isconfigured by both design and composition to provide heat dissipationand a vibration damping to the at least one electronic device 104, 601.Optionally, the Plastic Device Mounting Assembly 101 may comprise athermally conductive material having a minimum thermal conductivity ofabout 1.0 watts per meter-Kelvin (W/mK). Optionally, the Plastic DeviceMounting Assembly 101 may comprise a material that has a Shore Ahardness of less than about 70. Optionally, the Plastic Device MountingAssembly 101 may substantially enclose the at least one heat-generatingelectronic device 104, 601. Optionally, the Plastic Device MountingAssembly 101 may be configured as a reflected image of at least aportion of the at least one heat-generating electronic device 104, 601.Optionally, the Plastic Device Mounting Assembly 101 may be configuredas a reflected image of at least a portion of the supporting structure602.

In stage 604, a Plastic Device Mounting Assembly 101, 603 is placed inthermal and mechanical communication with a portion of the at least oneheat-generating electronic device 104, 601 and a portion of thesupporting structure 602. In one example, the Plastic Device MountingAssembly 101, 603 components are attached to the at least one electronicdevice 104, 601 by mechanical or chemical means that comprise screws,bolts, pins, clamps, slides, sockets, brackets, rivets, adhesives,locking/clipping structures, connection fingers, adhesives, thermalpastes, thermal pads, and thermal epoxies. In another example, thePlastic Device Mounting Assembly 101, 603 is configured to reflect atleast a portion of the surface of the at least one electronic device104, 601 such that the Plastic Device Mounting Assembly 101, 603 isclosely fitted and/or adjacent to the at least one electronic device104, 601 and may require no additional fasteners or adhesives to remainin place.

The Plastic Device Mounting Assembly 101, 603 with the installed atleast one electronic device 104, 601 is placed into the supportingstructure 602 using any suitable technique. In one example, PlasticDevice Mounting Assembly 101, 603 is attached to the at least oneelectronic device 104, 601 as described herein after which the PlasticDevice Mounting Assembly 101, 603 with the installed at least oneelectronic device 104, 601 is attached in place to the supportingstructure 602 by mechanical or chemical means that comprise screws,bolts, pins, clamps, slides, sockets, brackets, rivets, adhesives,locking/clipping structures, connection fingers, adhesives, thermalpastes, thermal pads, and thermal epoxies. In another example, PlasticDevice Mounting Assembly 101, 603 is pre-attached to the supportingstructure 602 by mechanical or chemical means that comprise screws,bolts, pins, clamps, slides, sockets, brackets, rivets, adhesives,locking/clipping structures, connection fingers, adhesives, thermalpastes, thermal pads, and thermal epoxies after which the at least oneelectronic device 104, 601 is attached in place to the Plastic DeviceMounting Assembly 101, 603 as described herein. In another example,Plastic Device Mounting Assembly 101, 603 is attached to the at leastone electronic device 104, 601 as described herein after which atemporary supporting structure is use to hold in place the PlasticDevice Mounting Assembly 101, 603 with the installed at least oneelectronic device 104, 601 until such time that the Plastic DeviceMounting Assembly 101, 603 with the installed at least one electronicdevice 104, 601 is attached in place to supporting structure 602 bymechanical or chemical means that comprise screws, bolts, pins, clamps,slides, sockets, brackets, rivets, adhesives, locking/clippingstructures, connection fingers, adhesives, thermal pastes, thermal pads,and thermal epoxies and the temporary supporting structure is removed.In another example, the Plastic Device Mounting Assembly 101, 603 isconfigured to reflect at least a portion of the surface of thesupporting structure 602 such that the Plastic Device Mounting Assembly101, 603 is closely fitted or adjacent to the supporting structure 602and may require no additional fasteners or adhesives to remain in place.In another example, the Plastic Device Mounting Assembly 101, 603 withthe installed at least one electronic device 104, 601 is placed into thesupporting structure 602 by a suitable compression of plastic, whichserves to hold in place and insure suitable mechanical and thermalcommunication between the Plastic Device Mounting Assembly 101, 603, theat least one electronic device 104, 601, and the supporting structure602. The placement of the Plastic Device Mounting Assembly 101, 603 withthe installed at least one electronic device 104, 601 into thesupporting structure 602 may be assisted mechanically and thermally byapplying any suitable pastes, greases, or lubricants to assist with theplacement.

FIG. 7 shows an additional embodiment of a Plastic Device MountingAssembly 101 described in FIG. 1. As illustrated in this embodiment, thePlastic Device Mounting Assembly 101, 701 may be comprised of one ormore components that that fits in close proximity or adjacent toelectronic device 104 which is omitted from this FIG for clarity.Plastic Device Mounting Assembly 101 may also be referred to as PlasticDevice Mounting Assembly 701 for clarity in differentiating theadditional design embodiment disclosed in this FIG. Embodiments ofPlastic Device Mounting Assembly 701 may be used advantageously in FIGS.1, 2, 3, 4, 5, 8, 9, 10, 11, 12. The Plastic Device Mounting Assembly701 has the characteristics and functionality as disclosed in FIG. 1.One or more Plastic Device Mounting Assembly 701 may be associated withan electronic device 104. A Plastic Device Mounting Assembly 701 may beassociated with one or more electronic devices 104. This embodiment ofPlastic Device Mounting Assembly 701 may be functionally described as arail that either attaches to electronic device 104 or supportingstructure that is omitted from this FIG for clarity. In this embodimentthe Plastic Device Mounting Assembly 701 described as a rail may be a)attached to electronic device 104 forming an assembly that is positionedadjacent to a supporting structure or b) attached to a supportingstructure forming an assembly in which an electronic device 104 ispositioned.

Plastic Device Mounting Assembly 701 may be comprised of one or morestructural features 702, 703, 704, 705, 706, 707. Base 702 serves as thepredominate surface upon which other features are located. Sides 703comprise outer guides configured to constrain the movement of theelectronic device 104 to within the boundaries of the Plastic DeviceMounting Assembly 701. Ribs 704 protrude from base 702 in order to comeinto contact with electronic device 104 or supporting structure. Ribs704 are advantageously designed such that electronic device 104 orsupporting structure move along the long axis of ribs 704 during anyoperations in which an electronic device 104 is inserted into or removedfrom a supporting structure. Ribs 704 may be of any dimensionality inorder to provide the required measure of thermal transfer fromelectronic device 104 to a supporting structure. Ribs 704 may be of anydimensionality in order to provide the required measure of vibrationdamping between electronic device 104 and a supporting structure. Ribs705 protrude from base 702 in order to come into contact with electronicdevice 104 or supporting structure and prevent electronic device 104 orsupporting structure from coming into contact with a fastener installedin countersunk hole 706. Countersunk holes 706 are located within base702 in order to allow attachment of Plastic Device Mounting Assembly 701to electronic device 104 or a supporting structure. Countersunk holes706 are configured to receive fastening devices which are omitted fromthis FIG for clarity. Fastening devices may be of any type and are mostadvantageously configured to be flush with the surface of base 702. Foot707 comprises a bottom guide configured to constrain the movement of theelectronic device 104 to within the boundary of the Plastic DeviceMounting Assembly 701.

FIG. 8A shows an additional embodiment of a collection of Plastic DeviceMounting Assemblies 701 attached to a supporting structure 802. ThePlastic Device Mounting Assemblies 701 and supporting structure 802 aredescribed by the characteristics and functions referenced by thedisclosures in FIG. 1. Electronic devices 104 that are associated withPlastic Device Mounting Assemblies 701 are omitted from this FIG forclarity and are illustrated in FIG. 10. Supporting structure 802 iscomprised of one or more thermally conductive materials or componentsthat are in thermal and/or mechanical communication with one or morePlastic Device Mounting Assemblies 701 and one or more fluid channels801. One or more supporting structures 802 may be connected together inthermal and/or mechanical communication with shared fluid channels 801to form a single supporting structure 802. Fluid channels 801 serve as aheat exchange mechanism to facilitate the removal of heat fromsupporting structure 802 that is absorbed by supporting structure 802from Plastic Device Mounting Assemblies 701 and associated electronicdevices 104. Any number of Plastic Device Mounting Assemblies 701 may beassociated with supporting structure 802 to form an assembly of anydimensionality. Plastic Device Mounting Assemblies 701 may be attachedto or associated with one or more surfaces of supporting structure 802.The embodiment in FIG. 8A is a view of an assembly of combinedsupporting structure 802, fluid channels 801, and Plastic DeviceMounting Assemblies 701 on one side of the supporting structure 802. Theembodiment in FIG. 8A is illustrated in a larger assembly of electronicdevices 104 and supporting structures 802 in FIG. 10.

FIG. 8B shows an additional embodiment of a collection of Plastic DeviceMounting Assemblies 701 attached to a supporting structure 802. ThePlastic Device Mounting Assemblies 701 and supporting structure 802 aredescribed by the characteristics and functions referenced by thedisclosures in FIG. 1. Electronic devices 104 that are associated withPlastic Device Mounting Assemblies 701 are omitted from this FIG forclarity and are illustrated in FIG. 10. Supporting structure 802 iscomprised of one or more thermally conductive materials or componentsthat are in thermal and/or mechanical communication with one or morePlastic Device Mounting Assemblies 701 and one or more fluid channels801. One or more supporting structures 802 may be connected together inthermal and/or mechanical communication with shared fluid channels 801to form a single supporting structure 802. Fluid channels 801 serve as aheat exchange mechanism to facilitate the removal of heat fromsupporting structure 802 that is absorbed by supporting structure 802from Plastic Device Mounting Assemblies 701 and associated electronicdevices 104. Any number of Plastic Device Mounting Assemblies 701 may beassociated with supporting structure 802 to form an assembly of anydimensionality. Plastic Device Mounting Assemblies 701 may be attachedto or associated with one or more surfaces of supporting structure 802.The embodiment in FIG. 8B is an exploded view of an assembly of combinedsupporting structure 802, fluid channels 801, and Plastic DeviceMounting Assemblies 701 on two sides of the supporting structure 802.The embodiment in FIG. 8B is illustrated in a larger assembly ofelectronic devices 104 and supporting structures 802 in FIG. 10.

FIG. 9A shows an additional embodiment of Plastic Device MountingAssemblies attached to at least one electronic device 104. Heatdissipation and a vibration damping assembly 950 is an additionalembodiment of the disclosures described in FIG. 1. As illustrated inthis embodiment, the Plastic Device Mounting Assembly 901 may becomprised of one or more components that that fits in close proximity oradjacent to the electronic device 104. The Plastic Device MountingAssembly 901 has the characteristics and functionality as disclosed inFIG. 1. One or more Plastic Device Mounting Assembly 901 may beassociated with an electronic device 104. A Plastic Device MountingAssembly 901 may be associated with one or more electronic devices 104.The embodiment of Plastic Device Mounting Assembly 901 may befunctionally described as a rail that attaches to an electronic device104. In this embodiment the Plastic Device Mounting Assembly 901 may beattached to electronic device 104 forming an assembly that is positionedadjacent to a supporting structure. FIG. 9A illustrates an embodiment inwhich the Plastic Device Mounting Assembly 901 is comprised ofcomponents that are located adjacent to each side of electronic device104.

FIG. 9B shows an additional embodiment of Plastic Device MountingAssemblies attached to at least one electronic device 104. Heatdissipation and a vibration damping assembly 950 is an additionalembodiment of the disclosures described in FIG. 1. As illustrated inthis embodiment, the Plastic Device Mounting Assembly 901 may becomprised of one or more components that that fits in close proximity oradjacent to the electronic device 104. The Plastic Device MountingAssembly 901 has the characteristics and functionality as disclosed inFIG. 1. One or more Plastic Device Mounting Assembly 901 may beassociated with an electronic device 104. A Plastic Device MountingAssembly 901 may be associated with one or more electronic devices 104.The embodiment of Plastic Device Mounting Assembly 901 may befunctionally described as a rail that attaches to an electronic device104. In this embodiment the Plastic Device Mounting Assembly 901 may beattached to electronic device 104 forming an assembly that is positionedadjacent to a supporting structure. FIG. 9B illustrates an embodiment inwhich the Plastic Device Mounting Assembly 901 is comprised ofcomponents that are located adjacent to each side of electronic device104 where each is an assembly comprised of a rail 903 and a cap 902.

FIG. 10 shows a conceptual view of an assembly 1050 of Plastic DeviceMounting Assemblies 1001 associated with electronic devices 104 andsupporting structures 802. Any number of Plastic Device MountingAssemblies 1001 and associated electronic devices 104 may be groupedtogether and associated with one or more supporting structures 802 toform an assembly 1050 of any dimensionality. Multiple instances ofassembly 1050 may be collected together and associated with othersupporting structures as part of a larger functioning unit. PlasticDevice Mounting Assemblies 1001 are comprised of configurations thatinclude one or more of a) the embodiment of FIG. 1 in which one or morePlastic Device Mounting Assemblies 101 are in close proximity oradjacent to electronic device 104, b) the embodiment of FIG. 2 in whichone or more Plastic Device Mounting Assemblies 101 are in closeproximity or adjacent to electronic device 104, c) the embodiment ofFIG. 3 in which one or more Plastic Device Mounting Assemblies 101 arein close proximity or adjacent to electronic device 104, d) theembodiment of FIG. 8 in which one or more Plastic Device MountingAssemblies 701 are attached to supporting structure 802, e) theembodiment of FIG. 9 in which one or more Plastic Device MountingAssemblies 901 are attached to electronic device 104, and f) theembodiment of FIG. 12 in which one or more Plastic Device MountingAssemblies 1201 are in close proximity or adjacent to electronic device104. In this embodiment, one or more Plastic Device Mounting Assemblies1001 are associated with each electronic device 104. The Plastic DeviceMounting Assemblies 1001 are too numerous for each to be labeledtherefore the labeled Plastic Device Mounting Assemblies 1001 are to beunderstood as typical in this FIG. The electronic devices 104 are toonumerous for each to be labeled therefore the labeled electronic devices104 are to be understand as typical in this FIG. A supporting structure802 may be associated with Plastic Device Mounting Assemblies 1001 andelectronic devices 104 on one or more surfaces of supporting structure802. The assembly 1050 of Plastic Device Mounting Assemblies 1001,electronic devices 104, and supporting structures 802 may be groupedtogether in rows as illustrated such that supporting structures 802 thatare internal to the assembly 1050 are associated with adjacent rows ofelectronic devices 104. Supporting structures 802 are configured to haveoptimal contact with Plastic Device Mounting Assemblies 1001. Not shownin this FIG. are additional structures that provide for specifieddimensionality between adjacent supporting structures 802 that include,but are not limited to a) fixed or adjustable mechanisms to maintain aspecified dimensionality between adjacent supporting structures 802, andb) fixed or adjustable mechanisms to maintain a specified amount ofpressure between adjacent supporting structures 802 and associatedPlastic Device Mounting Assemblies 1001. Fluid channels 801 serve as aheat exchange mechanism to facilitate the removal of heat fromsupporting structures 802 that is absorbed by supporting structures 802from Plastic Device Mounting Assemblies 1001 and associated electronicdevices 104. Fluid channels 801 are further connected to a heat exchangesystem that serve to reject the heat into an adjacent or remoteenvironment. Assembly 1050 is configured to allow electronic devices 104to be inserted into and removed from assembly 1050. Electronic devices104 may be inserted into and removed from the top of assembly 1050.Electronic devices 104 are vertically inserted into the top of assembly1050 guided by supporting structures 802 until the electronic device 104is fully inserted in assembly 1050. At the fully inserted position, theelectronic device 104 may be in contact with a base component 1002. Basecomponent 1002 may serve any appropriate function in assembly 1050including one or more functions such as structural support, electroniccommunication, and power source.

FIG. 11A shows a conceptual view of supporting structure configurations.Assembly 1110 comprised of one or more electronic devices 104 and one ormore Plastic Device Mounting Assemblies is comprised of configurationsthat include one or more of a) the embodiment of FIG. 1 in which one ormore Plastic Device Mounting Assemblies 101 are in close proximity oradjacent to electronic device 104, b) the embodiment of FIG. 2 in whichone or more Plastic Device Mounting Assemblies 101 are in closeproximity or adjacent to electronic device 104, c) the embodiment ofFIG. 3 in which one or more Plastic Device Mounting Assemblies 101 arein close proximity or adjacent to electronic device 104, d) theembodiment of FIG. 8 in which one or more Plastic Device MountingAssemblies 701 are attached to supporting structure 802, e) theembodiment of FIG. 9 in which one or more Plastic Device MountingAssemblies 901 are attached to electronic device 104, and f) theembodiment of FIG. 12 in which one or more Plastic Device MountingAssemblies 1201 are in close proximity or adjacent to electronic device104. FIG. 11A shows a top view of assembly 1150 comprised of assemblies1110 and supporting structures 802 with optional support structures1103. Assemblies 1110 are positioned between supporting structures 802.Any number of assemblies 1110 may be grouped together and associatedwith one or more supporting structures 802, 1103 to form an assembly1150 of any dimensionality. Supporting structure 802 may have anattached supporting structure 1103 that is in thermal and/or mechanicalcommunication with supporting structure 802 and is comprised of one ormore thermally conductive materials or components.

FIG. 11B shows a conceptual view of supporting structure configurations.Assembly 1110 comprised of one or more electronic devices 104 and one ormore Plastic Device Mounting Assemblies is comprised of configurationsthat include one or more of a) the embodiment of FIG. 1 in which one ormore Plastic Device Mounting Assemblies 101 are in close proximity oradjacent to electronic device 104, b) the embodiment of FIG. 2 in whichone or more Plastic Device Mounting Assemblies 101 are in closeproximity or adjacent to electronic device 104, c) the embodiment ofFIG. 3 in which one or more Plastic Device Mounting Assemblies 101 arein close proximity or adjacent to electronic device 104, d) theembodiment of FIG. 8 in which one or more Plastic Device MountingAssemblies 701 are attached to supporting structure 802, e) theembodiment of FIG. 9 in which one or more Plastic Device MountingAssemblies 901 are attached to electronic device 104, and f) theembodiment of FIG. 12 in which one or more Plastic Device MountingAssemblies 1201 are in close proximity or adjacent to electronic device104. FIG. 11B shows a top view of assembly 1151 comprised of assemblies1110 and supporting structures 802 with optional support structures1102, 1103. Assemblies 1110 are positioned in close proximity oradjacent to supporting structures 802 and optional supporting structures1102. Any number of assemblies 1110 may be grouped together andassociated with one or more supporting structures 802, 1102, 1103 toform an assembly 1151 of any dimensionality. Supporting structures 1102are supporting structures 802 that have been modified by removing fluidchannel 801. Supporting structure 802 may have an attached supportingstructure 1103 that is in thermal and/or mechanical communication withsupporting structure 802 and is comprised of one or more thermallyconductive materials or components.

FIG. 11C shows a conceptual view of supporting structure configurations.Assembly 1110 comprised of one or more electronic devices 104 and one ormore Plastic Device Mounting Assemblies is comprised of configurationsthat include one or more of a) the embodiment of FIG. 1 in which one ormore Plastic Device Mounting Assemblies 101 are in close proximity oradjacent to electronic device 104, b) the embodiment of FIG. 2 in whichone or more Plastic Device Mounting Assemblies 101 are in closeproximity or adjacent to electronic device 104, c) the embodiment ofFIG. 3 in which one or more Plastic Device Mounting Assemblies 101 arein close proximity or adjacent to electronic device 104, d) theembodiment of FIG. 8 in which one or more Plastic Device MountingAssemblies 701 are attached to supporting structure 802, e) theembodiment of FIG. 9 in which one or more Plastic Device MountingAssemblies 901 are attached to electronic device 104, and f) theembodiment of FIG. 12 in which one or more Plastic Device MountingAssemblies 1201 are in close proximity or adjacent to electronic device104. FIG. 11C shows a side view of assembly 1150 comprised of assemblies1110 and supporting structures 802 with optional support structures 1103as shown in FIG. 11A. Selected supporting structures 802 may beoptionally configured to be released from a fixed position in order torotate on hinge 1105 to position 1104.

FIG. 12 shows a conceptual view of a heat dissipation and a vibrationdamping assembly 1250 that is an additional embodiment of thedisclosures described in FIG. 1. As illustrated in this embodiment, thePlastic Device Mounting Assembly 1201 may be comprised of one or morecomponents that that fits in close proximity or adjacent to theelectronic device 104. The Plastic Device Mounting Assembly 1201 has thecharacteristics and functionality as disclosed in FIG. 1. One or morePlastic Device Mounting Assembly 1201 may be associated with anelectronic device 104. A Plastic Device Mounting Assembly 1201 may beassociated with one or more electronic devices 104. In this embodiment,electronic device 104 is disclosed as electronic memory or a solid statedrive. The embodiment of Plastic Device Mounting Assembly 1201 may befunctionally described as a cap that attaches to electronic device 104.In this embodiment the Plastic Device Mounting Assembly 1201 may beassociated with electronic device 104 forming an assembly that ispositioned adjacent to a supporting structure. A supporting structure isomitted from the FIG for clarity. In one embodiment, a supportingstructure would be located adjacent to a first plane of the PlasticDevice Mounting Assembly 1201 and electronic device 104 would be locatedadjacent to a second plane of the Plastic Device Mounting Assembly 1201.

Although example diagrams to implement the elements of the disclosedsubject matter have been provided, one skilled in the art, using thisdisclosure, could develop additional embodiments to practice thedisclosed subject matter and each is intended to be included herein.

In addition to the above described embodiments, those skilled in the artwill appreciate that this disclosure has application in a variety ofarts and situations and this disclosure is intended to include the same.

What is claimed is:
 1. A system for heat dissipation and vibrationdamping, said system comprising: at least one solid state drive; asupporting structure associated with said at least one solid statedrive; a thermally conductive and vibration damping plastic structure inthermal and mechanical communication with a portion of said at least onesolid state drive and a portion of said supporting structure; saidthermally conductive and vibration damping plastic structure comprisedof one or more materials, at least one of the one or more materialscomprising the property of being both thermally conductive and vibrationdamping; said thermally conductive and vibration damping plasticstructure interposed between said at least one solid state drive andsaid supporting structure; and said thermally conductive and vibrationdamping plastic structure configured to conduct heat away from said atleast one solid state drive.
 2. The system of claim 1, wherein saidthermally conductive and vibration damping plastic structure furthercomprises a thermally conductive material having a minimum thermalconductivity of about 1.0 watts per meter-Kelvin (W/mK).
 3. The systemof claim 1, wherein said thermally conductive and vibration dampingplastic structure further comprises a material having a Shore A hardnessof less than about
 70. 4. The system of claim 1, wherein said thermallyconductive and vibration damping plastic structure substantiallyencloses said at least one solid state drive.
 5. The system of claim 1,wherein said thermally conductive and vibration damping plasticstructure is configured into a reflected image of at least a portion ofthe surface of said at least one solid state drive such that saidreflected image is in direct contact with a portion of said surface ofsaid at least one solid state drive or indirect contact with a portionof said surface of said at least one solid state drive having thermalinterface materials disposed between said portions of said reflectedimage and said surface of said at least one solid state drive.
 6. Thesystem of claim 1, wherein said thermally conductive and vibrationdamping plastic structure is configured into a reflected image of atleast a portion of the surface of said supporting structure such thatsaid reflected image is in direct contact with a portion of said surfaceof said supporting structure or indirect contact with a portion of saidsurface of said supporting structure having thermal interface materialsdisposed between said portions of said reflected image and said surfaceof said supporting structure.
 7. The system of claim 1, wherein saidsupporting structure is configured to conduct heat away from saidthermally conductive and vibration damping plastic structure.
 8. Thesystem of claim 1, wherein said supporting structure further comprisesat least one fluid channel configured to conduct heat away from saidthermally conductive and vibration damping plastic structure.
 9. Amethod for heat dissipation and vibration damping, said methodcomprising: providing at least one solid state drive; providing asupporting structure adjacent to said provided at least one solid statedrive; providing a thermally conductive and vibration damping plasticstructure and placing said provided thermally conductive and vibrationdamping plastic structure in thermal and mechanical communication with aportion of said provided at least one solid state drive and a portion ofsaid provided supporting structure; comprising said thermally conductiveand vibration damping plastic structure of one or more materials, atleast one of the one or more materials comprising the property of beingboth thermally conductive and vibration damping; interposing saidprovided thermally conductive and vibration damping plastic structurebetween said provided at least one solid state drive and said providedsupporting structure; and providing said provided thermally conductiveand vibration damping plastic structure configured to conduct heat awayfrom said provided at least one solid state drive.
 10. The method ofclaim 9, wherein said provided thermally conductive and vibrationdamping plastic structure further comprises a thermally conductivematerial having a minimum thermal conductivity of about 1.0 watts permeter-Kelvin (W/mK).
 11. The method of claim 9, wherein said providedthermally conductive and vibration damping plastic structure furthercomprises a material having a Shore A hardness of less than about 70.12. The method of claim 9, wherein said provided thermally conductiveand vibration damping plastic structure substantially encloses saidprovided at least one solid state drive.
 13. The method of claim 9,wherein said provided thermally conductive and vibration damping plasticstructure is configured into a reflected image of at least a portion ofthe surface of said provided at least one solid state drive such thatsaid reflected image is in direct contact with a portion of said surfaceof said provided at least one solid state drive or indirect contact witha portion of said surface of said provided at least one solid statedrive having thermal interface materials disposed between said portionsof said reflected image and said surface of said provided at least onesolid state drive.
 14. The method of claim 9, wherein said providedthermally conductive and vibration damping plastic structure isconfigured into a reflected image of at least a portion of the surfaceof said provided supporting structure such that said reflected image isin direct contact with a portion of said surface of said providedsupporting structure or indirect contact with a portion of said surfaceof said provided supporting structure having thermal interface materialsdisposed between said portions of said reflected image and said surfaceof said provided supporting structure.
 15. The method of claim 9,wherein said supporting structure is configured to conduct heat awayfrom said thermally conductive and vibration damping plastic structure.16. The method of claim 9, wherein said supporting structure furthercomprises at least one fluid channel configured to conduct heat awayfrom said thermally conductive and vibration damping plastic structure.